An edge-grip normally closed (consistent-force) edge exclusion mechanical pick for handling round substrates from the wafer edge. The base material is ESD-safe polypropylene for longevity, antistatic properties, and general chemical resistance. The wafer contact pad is a perfluorinated O-ring strip for grip hold on the wafer without scratching or leaving out-gassing behind. Commonly used where double-sided wafers are being handled, also in application labs and for wafer rescue applications.